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Broadcom Begins Shipping Tomahawk6 Switch for Next-Gen AI Networks

Built on TSMC’s 3nm chiplet process, it delivers 102.4Tbps capacity to connect over one million AI accelerators in large-scale data centers.

The Broadcom company logo is shown outside one of their office complexes in Irvine, California, U.S., March 4, 2021.  REUTERS/Mike Blake//File Photo
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Overview

  • Broadcom began shipping its Tomahawk6 networking chip on June 3 to accelerate AI workloads.
  • The switch delivers 102.4 Tbps of data capacity—double its predecessor—enabling fewer switches to serve large AI clusters.
  • The chip uses a multi-chiplet design built on Taiwan Semiconductor Manufacturing Co.’s 3nm process for higher efficiency.
  • It accommodates more than one million AI accelerators with energy-efficient operations and flexible 100G/200G SerDes plus co-packaged optics.
  • Priced under $20,000 per unit, the launch has driven a stock uptick and underscores Broadcom’s push into AI infrastructure.