Overview

• The Biden-Harris Administration has signed a preliminary memorandum with Amkor Technology to provide $400 million in funding under the CHIPS and Science Act.
• Amkor's new facility in Peoria, Arizona, will be the largest advanced semiconductor packaging site in the U.S., supporting high-performance computing and AI.
• The project is expected to create 2,000 jobs and strengthen the domestic semiconductor supply chain.
• Amkor plans to utilize cutting-edge 2.5D technology crucial for AI and high-performance computing applications.
• The facility will support companies like TSMC, Apple, and GlobalFoundries in packaging and testing chips domestically.