Overview
- CTO Marco Pieters said ASML is researching advanced packaging equipment to bond and connect specialized dies, targeting a fast‑growing part of AI chip production.
- High‑NA EUV systems have processed about 500,000 wafers and are technically ready, but chipmakers are expected to need two to three years to integrate them for full‑scale output.
- ASML validated a 1,000‑watt EUV light source under customer conditions and sees a path to 1,500–2,000 watts that could lift throughput to roughly 330 wafers per hour by decade’s end.
- The company is examining ways to print larger chips beyond the current postage‑stamp limit and has introduced the XT:260 scanner for AI memory and processors, with more tools under exploration.
- Strong 2025 results and market support underpin the roadmap, with $39.16 billion in net sales, $11.5 billion in net income, a $46.47 billion backlog, and shares up more than 30% this year.