Overview

• Apple plans to introduce the A20 and A20 Pro chips in the iPhone 18, utilizing TSMC's 2nm manufacturing technology.
• The new chips will use Wafer-Level Multi-Chip Module (WMCM) packaging, replacing the current Integrated Fan-Out (InFo) method.
• This advanced packaging will allow for the integration of complex systems, enhancing performance and efficiency.
• The iPhone 18 series is expected to include 12GB of RAM, a significant increase from the current 8GB standard.
• Cost considerations may limit the 2nm technology to only the Pro models of the iPhone 18.