Overview

• Multiple outlets have corroborated Ming-Chi Kuo’s report that Apple will pair its next-generation A20 chip with TSMC’s 2nm node and Wafer-Level Multi-Chip Module packaging.
• WMCM employs MUF to integrate SoC and DRAM at wafer scale, reducing signal paths and boosting thermal management and power efficiency, with some A20 variants bonding RAM directly onto the CPU die.
• Mass production of the WMCM-packaged A20 is scheduled for the second half of 2026 in iPhone 18 Pro and foldable models, while standard iPhone 18 units may not arrive until spring 2027 due to cost and yield constraints.
• Eternal Materials outcompeted Japanese rivals to win a key MUF materials contract for TSMC’s WMCM process, underscoring the strategic role of qualified suppliers in Apple’s packaging shift.
• Leaked Apple code links the A20 rollout to a broader silicon upgrade that includes an A19 Pro-powered iPad mini, Vision Pro with an M5 chip, a new Apple TV with A17 Pro and a refreshed HomePod mini.