Overview

• Analyst Ming-Chi Kuo reports Apple’s A20 SoC for the iPhone 18 series will use Wafer-Level Multi-Chip Module packaging on TSMC’s 2nm process, replacing the current InFO approach.
• WMCM integrates the SoC and DRAM at the wafer level, reducing signal latency and improving thermal efficiency for AI tasks and high-end gaming.
• Eternal Materials has reportedly won a packaging materials contract for A20 WMCM production, marking a breakthrough against established Japanese suppliers.
• Leaked Apple internal code indicates upcoming devices including a Vision Pro with an M5 chip, an Apple TV 4K with an A17 Pro processor, an iPad mini with an A19 Pro chip, and a refreshed HomePod mini variant.
• Mass production of the A20 WMCM chips is expected in the second half of 2026 for iPhone 18 Pro and foldable models, with standard variants likely delayed until spring 2027 as TSMC scales capacity.