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Apple Set to Debut 2nm A20 Chip With Integrated RAM in iPhone 18 Pro Line

TSMC plans to scale a dedicated WMCM production line to meet projected demand by the end of 2027

Overview

  • Analyst Jeff Pu predicts iPhone 18 Pro, Pro Max and folding models will launch in September 2026 featuring Apple’s A20 chip built on TSMC’s second-generation 2nm process.
  • The A20 is expected to use Wafer-Level Multi-Chip Module packaging to combine RAM, CPU, GPU and Neural Engine in a single wafer-level package, reducing latency and improving thermal management.
  • The shift to 2nm technology could bring roughly 15% faster performance and 30% greater power efficiency compared with current 3nm chips.
  • TSMC’s AP7 facility will include a dedicated WMCM production line targeting 50,000 units per month by late 2026 and up to 120,000 units per month by the end of 2027.
  • Entry-level iPhone 18 and 18e models are not expected to incorporate the A20 chip until spring 2027, likely extending their release schedule.