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2w ago

Apple Eyes 2nm A20 with WMCM Packaging as Code Leak Maps Next-Gen SoCs

Supply-chain reports of a wafer-level multi-chip module shift for the A20 are supported by leaked code detailing M5, A19 Pro and A17 Pro chips across Apple’s device lineup.

Apple TV 4K to get A17 Pro according to new leak
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Overview

  • Analyst Ming-Chi Kuo reports Eternal Materials will handle wafer-level multi-chip modules for the A20 chip, marking a switch from InFO packaging on iPhone 18 Pro and foldable models in late 2026.
  • The A20 chip is also projected to use TSMC’s 2nm process node, a generational shrink aimed at improving power efficiency and raw performance for on-device AI.
  • WMCM packaging with MUF underfill may allow on-chip RAM integration, reducing latency and thermal loads to better support graphics-intensive and AI workloads.
  • Leaked Apple internal code discovered by researcher Aaron Perris indicates that the next Vision Pro will use an M5 chip, the iPad mini will gain an A19 Pro, the base iPad will adopt an A18, the Apple TV will upgrade to an A17 Pro and the HomePod mini will receive a T8310-based S-series core.
  • Actual device rollout and production yield details remain unconfirmed, with analysts expecting initial high-end launches in late 2026 and wider model availability or binned variants by spring 2027.