Overview
- Apple disclosed Tuesday that the iPhone Duo routes a flexible graphite pipe through its hinge to carry heat between the two halves and increase the surface area available for cooling.
- Engineers said the A20 Pro for the Duo uses wafer‑level multichip module (WMCM) packaging that places DRAM beside the processor to spread heat and create a more direct path from silicon to the vapor chamber.
- Apple described four thermal changes including a vapor chamber with roughly three times the surface area, a metal‑over‑foam interface to link chip to vapor chamber, and a nanotube copper back plate behind the foldable display to reduce hotspots.
- The Duo’s A20 Pro variant adds a second display engine to run inner and outer screens simultaneously and includes support for an under‑display FaceTime camera, features Apple says require the revised thermal design.
- Preorders start October 16 with shipments expected October 23, and reviewers will soon test whether the hinge cooling, vapor chamber and new packaging actually sustain performance and survive long‑term hinge cycles amid expected early supply limits.