Overview
- Apple announced Wednesday that it has agreed to a multiyear commitment expected to exceed $30 billion with Broadcom to design and produce custom silicon and wireless connectivity components for Apple products.
- The companies said the deal will result in more than 15 billion U.S.-made chips and that Broadcom will invest $1.5 billion to expand and modernize its Fort Collins, Colorado facility to make radio frequency parts including FBAR filters.
- Broadcom disclosed in an SEC filing that the supply relationship covers custom ASIC products through 2031, giving both firms long‑term demand visibility but not specifying when the new U.S. capacity will be fully operational.
- Apple described the pact as its largest commitment under the American Manufacturing Program and part of a broader $600 billion U.S. investment pledge, reflecting coordinated corporate and federal efforts to onshore critical semiconductor supply chains.
- The agreement is expected to support hundreds of American jobs, strengthen domestic production of connectivity parts used in iPhone and other devices, and could pressure other suppliers to expand U.S. manufacturing to compete for similar contracts.