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Apple Commits More Than $30 Billion to Broadcom for U.S. Chipmaking

A step toward building domestic chip capacity to secure radio‑frequency and connectivity parts for Apple devices.

Overview

  • Apple announced a multiyear agreement expected to exceed $30 billion that it says will produce more than 15 billion U.S.‑made connectivity and radio‑frequency chips.
  • Broadcom disclosed in an SEC filing that the supply pact runs through 2031 and covers custom ASIC silicon for multiple future generations of Apple products.
  • Broadcom will invest $1.5 billion to expand and modernize its Fort Collins, Colorado plant to make FBAR filters and other wireless components used in iPhones, iPads and wearables.
  • Apple and Broadcom did not provide a detailed timeline for when the new capacity will be fully online or at projected volumes, and converting purchase commitments into steady U.S. production will require yield proving and scale‑up time.
  • The deal is Apple’s largest commitment under its American Manufacturing Program and sits inside a broader $600 billion U.S. investment pledge that aims to boost on‑shore supply chains and support hundreds of American jobs.