Overview
- The iOS 26.3 and macOS 26.3 RC builds reference two unreleased M5-family SoCs, T6051 (H17C) and T6052 (H17D), which align with Apple’s internal codes for Max and Ultra chips.
- The expected M5 Pro identifier T6050 (H17S) is not present in the RC code, leaving the Pro variant’s timing or naming unclear.
- Multiple reports, citing a Weibo leaker with a mixed track record, claim Apple will adopt TSMC’s SoIC/2.5D packaging for higher-end M5 chips to improve heat dissipation and yields.
- Reporters tie the code findings to expectations for new MacBook Pro models in the February–March macOS 26.3 window, though Apple has not announced hardware.
- The Ultra reference raises the prospect of an M5 Ultra for desktops like a refreshed Mac Studio, but specific product allocations remain unconfirmed.