Overview
- GF Securities analyst Jeff Pu reports that the iPhone 18 Pro, Pro Max, and a book‑style iPhone Fold will share an A20 Pro chip built on TSMC’s N2 process, though Apple has not confirmed these details.
- The A20 Pro is said to adopt WMCM packaging that integrates RAM on‑package with the CPU, GPU, and Neural Engine to boost performance, reduce latency, and free internal space.
- Pu says the chip will add super‑high‑performance metal‑insulator‑metal capacitors to improve power stability, efficiency, and sustained performance.
- All three premium models are reportedly set for 12GB LPDDR5 memory and Apple’s in‑house C2 modem, aligning hardware for heavier on‑device AI workloads.
- Spec sheets cited by Pu list 6.3‑inch and 6.9‑inch Pro displays with triple 48MP rear cameras including variable aperture and periscope telephoto, plus an iPhone Fold with a 7.8‑inch inner display, roughly 5.3‑inch cover screen, dual 48MP rear cameras, dual 18MP front cameras, and Touch ID, with regular iPhone 18 variants projected for spring 2027 and 2026 iPhone shipments estimated at 250 million.