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Amkor Breaks Ground on $7 Billion Chip Packaging Campus in Peoria

The two-phase campus raises Amkor’s Arizona commitment to $7 billion to supply advanced packaging capacity for U.S. chipmakers.

Overview

  • Company leaders and Arizona officials held the Oct. 6 groundbreaking at North Lake Pleasant Parkway and Loop 303 in Peoria.
  • Amkor expanded the project to two phases totaling $7 billion, adding more than $5 billion for extra cleanroom space and a second greenfield facility with over 750,000 square feet of cleanroom capacity.
  • Construction of the first manufacturing plant is slated to finish in mid-2027, with production expected to begin in early 2028.
  • The company projects 3,000 jobs and says the site will be the largest outsourced advanced semiconductor packaging and test facility in the United States.
  • Amkor says the campus will complement TSMC’s wafer fabs, serve customers such as Apple and Nvidia, and benefit from CHIPS for America support, the Advanced Manufacturing Investment Tax Credit, and state and local contributions.