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AMD Showcases 'Helios' Open Rack-Scale AI Platform at OCP Global Summit

AMD positions the OCP-aligned reference rack to accelerate interoperable AI build-outs using the Meta Open Rack Wide standard.

Overview

  • The company publicly displayed a static Helios rack in San Jose built to Meta’s new Open Rack Wide double-wide specification for gigawatt-scale data centers.
  • Helios combines AMD Instinct GPUs, EPYC CPUs and Pensando networking with open fabrics, integrating OCP DC-MHS, UALink and Ultra Ethernet Consortium architectures.
  • The design features quick-disconnect liquid cooling, a serviceable double-wide layout and standards-based Ethernet intended to provide multi-path resiliency.
  • AMD describes Helios as an open, standards-based reference platform for OEMs, ODMs and hyperscalers to adopt and customize to speed AI infrastructure deployment.
  • AMD did not disclose detailed specifications, performance metrics or availability, and outside reports on component choices and competitive positioning remain unconfirmed by the company.