Particle.news
Download on the App Store

Adeia Sues AMD Over Hybrid-Bonding IP, Targeting 3D V-Cache and AI Chips

Adeia contends AMD’s stacked-chip designs use its patented hybrid bonding, prompting a bid for damages plus an injunction.

Overview

  • Adeia filed two patent suits on Nov. 3 in the U.S. District Court for the Western District of Texas, accusing AMD of infringing ten patents.
  • Seven of the asserted patents cover hybrid bonding and three relate to advanced process-node techniques used in logic and memory manufacturing.
  • The complaints cite AMD processors with 3D V-Cache, including models used in desktops, laptops, servers, and certain AI chips, as using the patented methods.
  • Adeia seeks unspecified monetary damages and a court order to stop use, while its CEO said the company remains open to a fair licensing arrangement.
  • AMD has not commented on the filings, and industry reporting notes near-term product injunctions are viewed as unlikely as early procedural challenges take shape.