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Adeia Sues AMD in Texas Over Hybrid Bonding Patents Used in 3D‑Stacked Chips

Adeia seeks damages plus an injunction in a case expected to hinge on early procedural rulings.

Overview

  • The complaints in the Western District of Texas assert ten patents, including seven on hybrid bonding and three on advanced process nodes.
  • Adeia alleges AMD processors with 3D V-Cache, including AI chips for PCs and servers, were manufactured using its patented methods.
  • The company requests unspecified monetary damages and a court order stopping further use while signaling willingness to license on “fair and reasonable” terms.
  • Adeia says it pursued licensing talks for years before filing, and AMD has not yet commented on the suits.
  • Legal analysis in coverage suggests near-term product disruption is unlikely under post-eBay injunction standards, with early challenges likely to be pivotal.